| Foreword to First Edition | xi |
| Preface | xiii |
| Acknowledgments | xvii |
| A Historical Perspective | xix |
| Chapter 1 | A Review of Materials Science | 1 |
| 1.1. | Introduction | 1 |
| 1.2. | Structure | 2 |
| 1.3. | Defects in Solids | 10 |
| 1.4. | Bonds and Bands in Materials | 14 |
| 1.5. | Thermodynamics of Materials | 24 |
| 1.6. | Kinetics | 36 |
| 1.7. | Nucleation | 44 |
| 1.8. | An Introduction to Mechanical Behavior | 47 |
| 1.9. | Conclusion | 52 |
| Exercises | 52 |
| References | 55 |
| Chapter 2 | Vacuum Science and Technology | 57 |
| 2.1. | Introduction | 57 |
| 2.2. | Kinetic Theory of Gases | 58 |
| 2.3. | Gas Transport and Pumping | 63 |
| 2.4. | Vacuum Pumps | 70 |
| 2.5. | Vacuum Systems | 81 |
| 2.6. | Conclusion | 88 |
| Exercises | 90 |
| References | 92 |
| Chapter 3 | Thin-Film Evaporation Processes | 95 |
| 3.1. | Introduction | 95 |
| 3.2. | The Physics and Chemistry of Evaporation | 97 |
| 3.3. | Film Thickness Uniformity and Purity | 106 |
| 3.4. | Evaporation Hardware | 118 |
| 3.5. | Evaporation Processes and Applications | 128 |
| 3.6. | Conclusion | 139 |
| Exercises | 140 |
| References | 143 |
| Chapter 4 | Discharges, Plasmas, and Ion-Surface Interactions | 145 |
| 4.1. | Introduction | 145 |
| 4.2. | Plasmas, Discharges, and Arcs | 147 |
| 4.3. | Fundamentals of Plasma Physics | 152 |
| 4.4. | Reactions in Plasmas | 164 |
| 4.5. | Physics of Sputtering | 170 |
| 4.6. | Ion Bombardment Modification of Growing Films | 184 |
| 4.7. | Conclusion | 196 |
| Exercises | 198 |
| References | 201 |
| Chapter 5 | Plasma and Ion Beam Processing of Thin Films | 203 |
| 5.1. | Introduction | 203 |
| 5.2. | DC, AC, and Reactive Sputtering Processes | 205 |
| 5.3. | Magnetron Sputtering | 222 |
| 5.4. | Plasma Etching | 233 |
| 5.5. | Hybrid and Modified PVD Processes | 252 |
| 5.6. | Conclusion | 269 |
| Exercises | 270 |
| References | 273 |
| Chapter 6 | Chemical Vapor Deposition | 277 |
| 6.1. | Introduction | 277 |
| 6.2. | Reaction Types | 281 |
| 6.3. | Thermodynamics of CVD | 287 |
| 6.4. | Gas Transport | 293 |
| 6.5. | Film Growth Kinetics | 303 |
| 6.6. | Thermal CVD Processes | 312 |
| 6.7. | Plasma-Enhanced CVD Processes | 323 |
| 6.8. | Some CVD Materials Issues | 334 |
| 6.9. | Safety | 347 |
| 6.10. | Conclusion | 349 |
| Exercises | 350 |
| References | 353 |
| Chapter 7 | Substrate Surfaces and Thin-Film Nucleation | 357 |
| 7.1. | Introduction | 357 |
| 7.2. | An Atomic View of Substrate Surfaces | 360 |
| 7.3. | Thermodynamic Aspects of Nucleation | 376 |
| 7.4. | Kinetic Processes in Nucleation and Growth | 386 |
| 7.5. | Experimental Studies of Nucleation and Growth | 400 |
| 7.6. | Conclusion | 409 |
| Exercises | 410 |
| References | 414 |
| Chapter 8 | Epitaxy | 417 |
| 8.1. | Introduction | 417 |
| 8.2. | Manifestations of Epitaxy | 420 |
| 8.3. | Lattice Misfit and Defects in Epitaxial Films | 429 |
| 8.4. | Epitaxy of Compound Semiconductors | 439 |
| 8.5. | High-Temperature Methods for Depositing Epitaxial Semiconductor Films | 453 |
| 8.6. | Low-Temperature Methods for Depositing Epitaxial Semiconductor Films | 466 |
| 8.7. | Mechanisms and Characterization of Epitaxial Film Growth | 476 |
| 8.8. | Conclusion | 488 |
| Exercises | 489 |
| References | 492 |
| Chapter 9 | Film Structure | 495 |
| 9.1. | Introduction | 495 |
| 9.2. | Structural Morphology of Deposited Films and Coatings | 497 |
| 9.3. | Computational Simulations of Film Structure | 510 |
| 9.4. | Grain Growth, Texture, and Microstructure Control in Thin Films | 520 |
| 9.5. | Constrained Film Structures | 533 |
| 9.6. | Amorphous Thin Films | 540 |
| 9.7. | Conclusion | 552 |
| Exercises | 553 |
| References | 556 |
| Chapter 10 | Characterization of Thin Films and Surfaces | 559 |
| 10.1. | Introduction | 559 |
| 10.2. | Film Thickness | 562 |
| 10.3. | Structural Characterization of Films and Surfaces | 583 |
| 10.4. | Chemical Characterization of Surfaces and Films | 606 |
| 10.5. | Conclusion | 633 |
| Exercises | 635 |
| References | 639 |
| Chapter 11 | Interdiffusion, Reactions, and Transformations in Thin Films | 641 |
| 11.1. | Introduction | 641 |
| 11.2. | Fundamentals of Diffusion | 643 |
| 11.3. | Interdiffusion in Thin Metal Films | 659 |
| 11.4. | Compound Formation and Phase Transformations in Thin Films | 669 |
| 11.5. | Metal-Semiconductor Reactions | 682 |
| 11.6. | Mass Transport in Thin Films under Large Driving Forces | 695 |
| 11.7. | Conclusion | 704 |
| Exercises | 704 |
| References | 708 |
| Chapter 12 | Mechanical Properties of Thin Films | 711 |
| 12.1. | Introduction | 711 |
| 12.2. | Mechanical Testing and Strength of Thin Films | 713 |
| 12.3. | Analysis of Internal Stress | 723 |
| 12.4. | Techniques for Measuring Internal Stress in Films | 735 |
| 12.5. | Internal Stresses in Thin Films and Their Causes | 742 |
| 12.6. | Mechanical Relaxation Effects in Stressed Films | 754 |
| 12.7. | Adhesion | 764 |
| 12.8. | Conclusion | 775 |
| Exercises | 776 |
| References | 779 |
| Index | 783 |
Format: Textbook Hardcover, 2nd ed., 8
